Design for Advanced Manufacturing: Technologies and Processes by LaRoux Gillespie

Author:LaRoux Gillespie [Gillespie, LaRoux]
Language: eng
Format: azw3
Publisher: McGraw-Hill Education
Published: 2017-05-12T04:00:00+00:00

* * *

Enhanced Manufacturability of MST

The CMP process was first applied to an MEMS technology known as polysilicon surface micro machining, but can be applied to any MST wherein topography is introduced by the repetitive deposition and patterned etching of multiple films. Typically, at the completion of the MST fabrication, sacrificial layers (as their name suggests) are selectively removed, leaving the free-standing device structures in the form of channels, gears and linkages, or mirrors. Figures 3.14.3a to c both illustrate the essence of polysilicon surface micro machining and display the vertical topography which arises during a nonplanarized process. This topography can produce mechanical interference between moving parts and can complicates subsequent process steps. Figure 3.14.3a schematically illustrates this interference, where a completed linkage element is intended to move a lateral distance, ΔD, but is stopped at a travel of δt < ΔD due to the obstruction from a nonplanarized upper layer in the process.

Download

Copyright Disclaimer:
This site does not store any files on its server. We only index and link to content provided by other sites. Please contact the content providers to delete copyright contents if any and email us, we'll remove relevant links or contents immediately.